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About STIE 2026

2026 International Conference on Sensor Technology and Information Engineering


In the context of the in-depth development of the Internet of Everything and the wave of intelligence, sensor technology and information engineering, as the cornerstone of perceiving the physical world and building digital twins, are facing huge development opportunities and innovation challenges. With the continuous breakthrough of new materials and new processes, the increasing maturity of micro-electromechanical systems ( MEMS ) and the deep integration with artificial intelligence and Internet of Things technology, the technology iteration and application innovation in this field are unprecedentedly active.The 2026 International Conference on Sensor Technology and Information Engineering ( STIE 2026 ) will be held in Tianjin, China from April 17 to 19,2026.This conference aims to bring together experts, scholars, researchers and industry elites from academia and industry at home and abroad to conduct extensive and in-depth discussions on cutting-edge exploration, design innovation, system integration and future prospects in the field of sensor technology and information engineering. 

We sincerely welcome scholars, engineers and industry representatives from all over the world who are engaged in related research to participate in the conference, share their insights, exchange innovative practices, jointly promote the interdisciplinary integration and coordinated development of sensor technology and information engineering disciplines, and contribute wisdom to the intelligent upgrading of the enabling industry and the prosperity of the digital economy.

重要时间

Important Dates

Full Paper Submission Date

February 15, 2026

Registration Deadline

February 30, 2026

Final Paper Submission Date

March 10, 2026

Conference Dates

April 17-18, 2026

other

Call For Papers

hot.gif The topics of interest include, but are not limited to:

Sensor Technology and Application

New Material Sensor

Flexible and Wearable Sensor Technology

Physical / Chemical / Biological Sensors

Intelligent Sensors and Systems

Micro-Electro-Mechanical System (MEMS) and Nano-Electro-Mechanical System (NEMS) Technology

Chip-Level Sensor

Quantum Sensing and Precision Measurement

Low Power Consumption and Self-Powered

Miniaturization and Integration

Bio-Inspired Sensing and Biological Compatibility

Optics and Imaging Sensing


Sensor Signal Processing and Intelligent Information Fusion

Signal Filtering and Noise Reduction

Cloud Computing and Edge Algorithm

Deep Learning

Brain-Like Computing

Data Feature Extraction and Recognition

Real-Time Signal Processing and Decision Making

Multimodal, Heterogeneous Integration

Sensing Data Compression and Transmission Coding

Vision and Radar Sensing Information Fusion

Quality Control

Information Complementation

Data Fusion Algorithm


Wireless Sensor Network and Internet of Things Technology

Submission

news.gif Please send the full paper(word+pdf) to Submission System : 

Submission System (Chinese)

Submission System  (English)

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Publication

Publication

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.

Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

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