The 2026 International Conference on Sensor Technology and Information Engineering (STIE 2026) will be held as the workshop of The 11th International Conference on Intelligent Computing and Signal Processing (ICSP 2026). 

· Conference Chairs

Prof. Zhen Zhang Zhengzhou University,China

Prof. Ainuddin Wahid Abdul Wahab University Malaya,Malaysia

Assoc. Prof. Morteza SaberiKamarposhti IEEE Senior Member Sunway University, Malaysia

·Technical Program Committee Chairs

Prof. Zhao Haiquan IEEE Senior Member Southwest Jiaotong University, China

Prof. Lei Yang  IEEE Senior Member Zhengzhou University,China

Prof. Tianlei Ma  Zhengzhou University,China

· Publication Chairs

Prof. Yan Yang  Southwest Jiaotong University, China

Assoc. Prof. Saaidal Razalli Azzuhri Universiti Malaya, Malaysia

Assoc. Prof. Low Siew Chun Universiti Sains Malaysia,Malaysia

· Technical Program Committe Members

Chuah Yea Dat, Tunku Abdul Rahman University of Management and Technology,Malaysia

Tan Xiao Jian,Tunku Abdul Rahman University of Management and Technology, Malaysia

Goh Kam Meng,Tunku Abdul Rahman University of Management and Technology, Malaysia

Yeo Kwok Shien, Tunku Abdul Rahman University of Management and Technology, Malaysia

José Abel Herrera Camacho, Universidad Nacional Autónoma de México, Mexico

Shengxian Cao, Northeast Electric Power University, China

Komalpreet Kaur, Salem State University, USA

Jianpo Li, Northeast Electric Power University, China

Jinsong Wu, University of Chile, Chile

Sabeen Tahir, King Abdulaziz University Jeddah, Saudi Arabia

N.Rajathi, Kumaraguru College of Technology, India

David Bamman, University of California, Berkeley, USA

· Publicity Committe Members

SALFARINA BINTI ABDULLAH / FSKTM, Universiti Putra Malaysia, Malaysia

Rozi Nor Haizan Nor, Universiti Putra Malaysia, Malaysia